| PART |
Description |
Maker |
| 55PC1221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0114 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0233 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| XPC745BPX350LD XPC745BPX300LD MPC755BLDPND MPC755B |
MPC755 Part Number Specification for the XPC755BxxnnnLD and XPC745BxxnnnLD Series
Part Number Specification for the XPC755BxxnnnLD andXPC745BxxnnnLD Series
|
Motorola
|
| 4435 ARX4435 ARX4435-701 ARX4435-FP |
ARX4435 Transceiver for Macair H009 Specification ARX4435收发器规格为Macair H009
ARX4435N Transceiver for Macair H009 Specification
|
Aeroflex, Inc.
Aeroflex Inc.
AEROFLEX[Aeroflex Circuit Technology]
|
| SE7210TP1-E |
Intel庐 Server Board Technical Product Specification
Intel? Server Board Technical Product Specification
|
Intel Corporation
|
| MPC8308101 MPC8308 MPC8308CVMADDA MPC8308CVMAFDA M |
MPC8308 PowerQUICC II Pro Processor Hardware Specification
MPC8308 PowerQUICC II Pro Processor Hardware Specification
|
Freescale Semiconductor, Inc
|
| CL31A335KOCLNNC |
SPECIFICATION
|
Samsung semiconductor
|
| PH967C6 |
SPECIFICATION
|
ETC[ETC]
Fuji Electric
|
